Network World
Summary
AI infrastructure has a resource problem that gets worse the more you try to solve it. Every generation of GPU accelerator draws more power and rejects more heat than the last — next-generation AI racks are projected to reach densities north of 300 kW, up from roughly 6 kW just a few years ago. The industry’s answer has been liquid cooling: direct-to-chip cold plates, rear-door heat exchangers, immersion tanks. It works. But it also creates a second, quieter problem that gets far less boardroom attention than the first: liquid cooling is extremely good at capturing heat and comparatively wasteful about what happens to that heat afterward. Most of it is still rejected to a cooling tower or dry cooler and paid for twice — once to remove it from the chip, and again to run the electric chiller plant that keeps the facility cold.
Continue Reading
#News#DataCenter#DistrictEnergy