engineering.com
Summary
The company raised a $20M Series A in September 2025 and says the water-free platform supports heat reuse for power or district heating.
Karman Industries announced the launch of the Heat Processing Unit (HPU), a modular 10MW integrated thermal platform engineered to solve the “speed-to-power” crisis facing AI hyperscalers. By consolidating massive heat management infrastructure into high-density modular packages, Karman’s HPU unlocks rapid deployments while eliminating water consumption. HPUs optimize energy consumption, providing the most efficient cooling while unlocking heat reuse for power generation or district heating.
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